Date: 04-07-10
Title:
Boundary Scan Software Platform SYSTEM CASCON automates hierarchical Test of Multi Chip Modules
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Comment: OEPEL electronic introduces new features to specially support hierarchical tests of Multi Chip Modules (MCM) as new extension of its software platform SYSTEM CASCON™. The enhanced tools provide a hitherto unrivalled automation level for the generation of module and board centric Boundary Scan tests based on hierarchical library models. “In practice, Multi Chip Modules play a highly important role to implement system-on-chip designs with integrated IEEE 1149.1 structures. Our new system features help to improve the efficiency of hierarchical test generation”, says Thomas Wenzel, Managing Director of the Boundary Scan division of the GOEPEL electronic GmbH. The MCM models’ full independence from target board design ensures a complete portability of the entire package, and releases users from handling hierarchical CAD and Boundary Scan data.”
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